Mijing MS1 Heating Station for iPhone Motherboard Separation
Mijing MS1 Heating Station for iPhone Motherboard Separation
Mijing MS1 Heating Station for iPhone Motherboard Separation
Mijing MS1 Heating Station for iPhone Motherboard Separation
Mijing MS1 Heating Station for iPhone Motherboard Separation
Mijing MS1 Heating Station for iPhone Motherboard Separation

OEM

Mijing MS1 Heating Station for iPhone Motherboard Separation

Sale price$99.90
Model:MS1 + 6 Modules (X-15 series)
Quantity:

Four-in-one universal iPhone X~15Pro Max support A15 CPU chip, A15 HHD, iPhone 13 baseband.

*Note: The manufacturer of the product will conduct a test before shipment, and the heating cotton in the inner liner of the main unit may feel a little yellow.

Function

  • Module A: Multifunctional Bezel Separating Expansion
  • For CPU chip removing, Face ID dot matrix and Touch-ID repairing
  • Module B: MS1-IP 11 Series Expansion
  • For IP X/XS/XS Max/11 Series motherboard preheating and desoldering
  • Module C: MS1-IP 12 Series Expansion
  • For IP 12 Series motherboard preheating and desoldering
  • Module D: MS1-IP 13 Series Expansion
  • For IP 13 Series motherboard preheating and desoldering
  • Module D: MS1-IP 14 Series Expansion
  • For IP 14 Series motherboard preheating and desoldering

mijing ms1

Specifications

  • Brand: Mijing & iRepair
  • Model: MS1
  • Product Name: Universal Desoldering Platform
  • Main Use: Preheating/Desoldering
  • Input Voltage: 110/220V (Dual gear shift with one button)
  • Temperature Regulation: 50-300°
  • Application: Preheat soldering of electronic products and PCB
  • Products include: MS1 Desoldering Platform*1, Upgrade expansion module*4