The SS-T12A Motherboard Heating Platform is available for various heating needs like iPhone X-13 Series Motherboard/CPU/Face ID Parts etc. (The Main Unit should be used with different Modules according to application.)
- Adopting 185-degree layered process to remove the IP-X motherboard, not only from our fine analysis of IP-X solder paste ,but depends on the special heating design and precise temperature control of SS-T12A.
- SS-T12A only heats the area that the IP-X board needs to be removed to prevent improper heating.
- Dual bayonet design, make sure the IP-X motherboard is stable on the stage.
- High purity copper is used as a film to ensure uniform heat transfer and heat.
T12A-CPU: Suitable for iPhone 6-8P CPU layers separation and glue cleaning
T12A-X3: Suitable for the iPhone X/XS/XS Max Motherboard heating and separation
T12A-FACE: Suitable for heating, fixing, separating, removing glue of other Face ID cables, dot matrix module devices
T12A-M6: Suitable for the iPhone X/XS/XS Max/11/11 Pro/11 Pro Max Motherboard
heating and separationT12A-N12: Suitable for the iPhone 12/12 Pro/12 Pro Max/12 Mini Motherboard heating and separation
T12A-N13: Suitable for the iPhone 13/13 Pro/13 Pro Max/13 Mini Motherboard heating and separation
- Model: SS-T12A
- Main unit size: 124*90*40mm (L*W*H)
- Input: AC110-230V, 50/60Hz, 5A
- Net weight: 375g
- Rated Power: 70W
- Temperature: 100-280℃