Mijing Z20 Pro BGA Rework Stencils 14in1 for iPhone Motherboard Soldering

Z20 Pro  BGA Rework Stencils 14 in 1 middle layer planting tin platform is a professional BGA reballing stencil fixture for iPhone X-13/13 Pro PCB BGA repair, mobile phone motherboard repair jig fixture used for positioning and reballing iPhone X-13 Pro Max PCB BGA parts.

Z20 Pro BGA rework stencil greatly simplifies your rework process while providing for a more reliable connection This method features a unique stay-in-place feature which simplifies the placement while increasing the yield of reworked BGAs.

Support model：13/13 Pro/13 Pro-max/13 mini/12/12 Pro/12 Pro-max/12 mini/11/11 Pro/11 Pro-max/XS/Xs-max/X

Usage Steps :
Take out the Z20 tin planter and place the bottom platePlace gaskets as needed (when planting tin in the RF middle frame of the XS Max motherboard, you need to place functional functional gaskets and then place the RF dedicated tin planting net)Place the main board and locate it through the positioning column and limit areaPlace the tin-planting net magnet according to the model to automatically adsorb the positioning hole and align the tin-planting station positioning postPlace tin spacers according to requirementsUse a tin scraper to evenly fill the mesh with tin paste

How to install :
Install the iPhone X-13/13 Pro main board on the platformCover the iPhone X-13/13Pro BGA reballing stencil on mainboardEvenly spread tin on the cover of the reballing stencilRemove the reballing stencil coverTake out the motherboard and cooperate with the hot air gun to solidify the tin point.